Abstract: Silicon photonics offers excellent integration of passive components, modulators and detectors, but the integration of III-V lasers and fibre attach remain as challenges. Photonic wire bonding offers the potential to solve these two main problems for both prototype level and high-volume manufacturing.
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Slides PDF: https://www.dropbox.com/s/b6wbkcq5b4ku5vy/IEEE%20IPC%202021%20PWB.pdf?dl=1