A computer circuit board manufacturer encountered issues using commercial thermal interface materials for adhering heat transfer lids onto computer chips. A problem-solving team was brought in to evaluate the situation. Multiple causation theories were proposed, and the lead root cause concept was evaluated using a 3-factor response surface (RSM) DOE.
Thermally conductive adhesives transfer heat emitted by chips to the external environment. However, sporadic excessive voids in the adhesive had degraded performance and led to scrapping computer chips at the manufacturer. An effective solution was urgently needed. The RSM confirmed root cause, provided processing guidelines to the circuit board manufacturer, and allowed adhesive specifications to be created by using tolerance interval valuation. Implementation of the finding resulted in complete elimination of excessive adhesive voids.
Slides: https://statease.com/documents/464/Day_2-2_Richard_Williams_Chip_Bubble_DOE_-_SE_Format.pdf
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