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Solving 3D Module Integration Challenges for High-Performance Microwave Design

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This paper and demonstration will explore the assembly, integration, and Circuit-EM validation of a typical dual-band smartphone Front-End Module (FEM) in ADS using the latest innovations in the SmartMount and RFPro software elements. Learn: • How wireless transceiver designers must integrate RFIC and MMIC components, switches, matching networks and 3D components into densely packed LTCC modules. • How these designs concentrate a variety of challenges into very small spaces, requiring various technologies and co-design workflows. • How the FEM, Momentum, and Electro-Thermal simulators, as well as the Layout Connectivity and Layout Verification tools such as LVS, DRC, and ERC that are needed to fabricate physical designs with full confidence. How to Design Multi-Technology mmWave Phased Arrays https://www.keysight.com/us/en/solutions/design-multi-technology-mmwave-phased-arrays.html Apply for a Free Trial of ADS https://www.keysight.com/find/ads-evaluation W3606B ADS Core, EM Design, Layout, RFPro, RF Ckt Sim https://www.keysight.com/products/W3606B

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