Rob Smith (Product Line Director RF and mmWave Compound Semiconductors), CML Micro presenting at Interlligent UK's 2024 RF & Microwave Design Seminar.
Every packaged IC needs to be tested to confirm it can meet its specified performance. This entails testing enough parameters to verify functionality whilst adopting an approach that keeps test time, and hence cost, down to an acceptable level. As device operating frequencies increase there are additional challenges such as the impact of the test socket on RF performance and ensuring correlation between soldered-down performance and test socket performance. Other challenges such as thermal management and ensuring repeatability must also be addressed.
High volume test of packaged ICs often takes place in locations where labour costs are low and the impact on unit price can be minimised. However, with the right approach it is possible to undertake cost-effective high-volume production test of packaged RF, microwave and mmWave ICs in the UK. This requires careful design of the test set-up, optimisation of the test procedures and appropriate levels of automation.
This presentation described the approach taken to do this, including details of the load-board design, test procedure optimisation, and automation of the test procedure.